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oH V SC AV ER OM AI SIO PL LA N IA BL S NT E
TISP6L7591 DUAL FORWARD-CONDUCTING P-GATE THYRISTORS PROGRAMMABLE OVERVOLTAGE PROTECTORS
*R
TISP6L7591 SLIC Protector
Rated for Standard Lightning Wave Shapes
Wave Shape 2/10 10/700 10/1000 Standard GR-1089-CORE IPP A 80
D Package (Top View)
TIP VS NC RING
1 2 3 4
8 7 6 5
PT GND GND PR
MD6XAND
ITU-T K.20 & K.21 40 GR-1089-CORE 30
Rated for AC Fault Currents
AC Hz 50/60 1 Time ITSM s 0.01 A 5 3.5
Device Symbol
TIP (1)
PT (8)
GND (7) VS (2) GND (6)
Gate Trigger Current ............................................... 15 mA max. High VS Voltage ......................................................... -80 V max. High Holding Current ............................................. 150 mA min.
............................................ UL Recognized Components
Pin 1 Symbol TIP VS NC RING Comment Line-side TIP Supply voltage to Gate No Internal connection Line-side RING Pin 8 7 6 5 Symbol PT GND GND PR
RING (4)
PR (5)
SD6XAEE
Comment Protected TIP to SLIC Ground Ground Protected RING to SLIC
Description
The TISP6L7591 is a dual forward-conducting buffered p-gate overvoltage protector. It is designed to protect monolithic SLICs (Subscriber Line Interface Circuits) against overvoltages on the telephone line caused by lightning, a.c. power contact and induction. The TISP6L7591 limits voltages that exceed the SLIC supply rail voltage. The SLIC line driver section is typically powered from 0 V (ground) and a negative voltage, VS, in the region of -20 V to -80 V. The protector gate is connected to this negative supply. This references the protection (clipping) voltage to the negative supply voltage. The negative protection voltage will then track the negative supply voltage and the overvoltage stress on the SLIC is minimized.
2 3 4
Note: Pins 1 and 4 must always be connected to the protection resistors shown in Figures 2 and 3 (Line Feed Circuitry). The SLIC can be connected either to the protected outputs (pins 5 and 8) or to the inputs (pins 1 and 4).
Positive overvoltages are clipped to ground by diode forward conduction. Negative overvoltages are initially clipped close to the SLIC negative supply rail value. If sufficient current is available from the overvoltage, then the protector will switch into a low voltage on-state condition. As the overvoltage subsides the high holding current of TISP6L7591 crowbar prevents d.c. latchup. These monolithic protection devices are fabricated in ion-implanted planar vertical power structures for high reliability and in normal system operation they are virtually transparent. The TISP6L7591 is available in 8-pin plastic small-outline surface mount package.
How To Order
For Standard Termination Finish Order As
TISP6L7591DR
Device
Package
Carrier
For Lead Free Termination Finish Order As
TISP6L7591DR-S
TISP6L7591 D (8-pin Small-Outline) R (Embossed Tape Reeled)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex MAY 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP6L7591 SLIC Protector
Absolute Maximum Ratings, TA = 25 C (Unless Otherwise Noted)
Rating Repetitive peak TIP or RING off-state voltage, V(VS)(TIP) = 0, V(VS)(RING) = 0 Repetitive peak VS voltage, VTIP = 0, VRING = 0 Non-repetitive peak pulse current (see Notes 1, 2 and 3) 10/1000 s (Bellcore GR-1089-CORE, open-circuit voltage wave shape 10/1000 s) 5/320 s (ITU-T K.20 & K.21, open-circuit voltage wave shape 10/700 s) 2/10 s (Bellcore GR-1089-CORE, open-circuit voltage wave shape 2/10 s) Non-repetitive peak on-state current, 50 Hz to 60 Hz (see Notes 1, 2 and 3) 10 ms 1s Non-repetitive peak VS current, half sine wave 10 ms, cathodes commoned (see Note 1) Operating free-air temperature range Storage temperature range I(VS)M TA Tstg ITSM 5 3.5 +2 -40 to +85 -40 to +125 A C C A IPP 30 40 80 A Symbol V(TIP)M , V(RING)M V(VS)M Value -100 -80 Unit V V
NOTES: 1. Initially the protector must be in thermal equilibrium. The surge may be repeated after the device returns to its initial conditions. 2. These non-repetitive rated currents are peak values for either polarity. The rated current values may be applied either to the Ring to Ground or to the Tip to Ground terminal pairs. Additionally, both terminal pairs may have their rated current values applied simultaneously (in this case the Ground terminal current will be twice the rated current value of an individual terminal pair). 3. Supply Voltage, VS , range -20 V to -80 V.
Electrical Characteristics, TA = 25 C (Unless Otherwise Noted)
Parameter VF VFP IGT IH VT VSGL IRG dvR/dt VON IR Coff Forward voltage Peak forward voltage Gate trigger current Holding current Trip voltage Dynamic trip voltage Reverse gate current Critical rate of voltage rise On-state voltage Reverse current (Gate open) TIP or RING to GND off-state capacitance IP = 5 A, t P = 1 ms IPP = 30 A, 10/1000 VS = -48 V t P = 10 ms, VS = -48 V d.c. IPP = -30 A, 10/1000, VS = -48 V VS = -75 V, VTIP = 0, VRING = 0 TIP or RING lead IT = -0.5 A, t P = 1 ms IT = -3.0 A, t P = 1 ms VR = -85 V, IG = 0 f = 1 MHz, Vd = 1 V, IG = 0, (see Note 4) TA = 25 C TA = 70 C VR = -3 V VR = -48 V TA = 25 C TA = 70 C 1000 -3 -4 -5 -50 50 40 0.2 -150 VS-2.8 -63 -5 -50 Test Conditions Min Typ Max 3 15 15 Unit V V mA mA V V A A V/s V A A pF pF
NOTE 4: These capacitance measurements employ a three terminal capacitance bridge incorporating a guard circuit. The unmeasured device terminals are a.c. connected to the guard terminal of the bridge.
MAY 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP6L7591 SLIC Protector
Parameter Measurement Information
+i IPP Quadrant I Forward Conduction Characteristic
ITSM IP VF
-v
VR IR
+v
IH
VSGL
VON IT ITSM
Quadrant III Switching Characteristic IPP -i
PM6XAAZ
Figure 1. Typical Voltage-Current Characteristic of the SLIC Protector Unless Otherwise Noted, All Voltages are Referenced to the Anode
Letter Symbol Definitions
Symbol IH IGT IP IPP IRG IT IR VF VFP VT VSGL VON VR Coff Parameter Thyristor holding current Gate trigger current into VS pin Pulse current Peak pulse current Reverse current VS to TIP or RING TIP or RING current when thyristor is on Reverse current, TIP or RING to GND Forward voltage, TIP or RING to GND Peak forward voltage, TIP or RING to GND Trip voltage, TIP or RING to VS Dynamic trip voltage, TIP or RING to VS Thyristor on voltage at IT TIP or RING voltage when thyristor is off Off-state capacitance, TIP or RING to Ground
MAY 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP6L7591 SLIC Protector
APPLICATIONS INFORMATION
TIP RPT
TIP (1)
PT (8)
Protected Tip
GND (7) VS VS (2) RPR RING RING (4) PR (5) GND (6) Protected Ring
RPT and RPR must be properly selected for proper operation and/or response.
AI6XDN
Figure 2. Standard Configuration
IP
TIP (1) RPT
PT (8)
VMEAS GND (7) -48 V VS (2) RPR IP RING (4) GND (6) VMEAS PR (5)
AI6XDO
Figure 3. Test Circuit
MAY 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP6L7591 SLIC Protector
MECHANICAL DATA
Device Symbolization Code
Devices will be coded as below.
Device TISP6L7591D
Symbolization Code L7591
MAY 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP6L7591 SLIC Protector
MECHANICAL DATA
D008 Plastic Small-outline Package
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound is designed to withstand normal soldering temperatures with no deformation and circuit performance characteristics will remain stable when operated in most high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
D008
4.80 - 5.00 (0.189 - 0.197)
8-pin Small Outline Microelectronic Standard Package MS-012, JEDEC Publication 95
8
7
6
5
5.80 - 6.20 (0.228 - 0.244)
INDEX
3.81 - 4.00 (0.150 - 0.157)
1
2
3
4
1.35 - 1.75 (0.053 - 0.069)
7 NOM 3 Places
0.25 - 0.50 x 45 N0M (0.010 - 0.020)
4.60 - 5.21 (0.181 - 0.205)
0.102 - 0.203 (0.004 - 0.008) 0.28 - 0.79 (0.011 - 0.031) Pin Spacing 1.27 (0.050) (see Note A) 6 places
0.36 - 0.51 (0.014 - 0.020) 8 Places 0.190 - 0.229 (0.0075 - 0.0090)
7 NOM 4 Places 0.51 - 1.12 (0.020 - 0.044)
44
DIMENSIONS ARE:
MILLIMETERS (INCHES)
NOTES: A. B. C. D.
Leads are within 0.25 (0.010) radius of true position at maximum material condition. Body dimensions do not include mold flash or protrusion. Mold flash or protrusion shall not exceed 0.15 (0.006). Lead tips to be planar within 0.051 (0.002).
MDXXAA E
MAY 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP6L7591 SLIC Protector
MECHANICAL DATA
D008 Tape DImensions
D008 Package (8-pin Small Outline) Single-Sprocket Tape
3.90 - 4.10 (.154 - .161) 7.90 - 8.10 (.311 - .319) 1.95 - 2.05 (.077 - .081)
1.50 - 1.60 (.059 - .063) 0.40 (.016)
0.8 MIN. (.03)
5.40 - 5.60 (.213 - .220) 11.70 - 12.30 (.461 - .484)
6.30 - 6.50 (.248 - .256)
o 1.50 MIN. (.059)
0 MIN.
Direction of Feed
Cover Tape
Carrier Tape Embossment
2.0 - 2.2 (.079 - .087)
DIMENSIONS ARE:
MILLIMETERS (INCHES)
NOTES: A. Taped devices are supplied on a reel of the following dimensions:Reel diameter: Reel hub diameter: Reel axial hole:
330 +0.0/-4.0 (12.99 +0.0/-.157) 100 2.0 (3.937 .079) 13.0 0.2 (.512 .008)
MDXXATC
B. 2500 devices are on a reel.
"TISP" is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office. "Bourns" is a registered trademark of Bourns, Inc. in the U.S. and other countries.
MAY 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.

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